ARP1612A Polyimide Printed Circuit Boards Fabrication of
Reaffirmed
06/05/2022
- Features
- Issuing Committee
- Content
- This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
- Pages
- 18
- Citation
- SAE International Recommended Practice, Polyimide Printed Circuit Boards Fabrication of, SAE Standard ARP1612A, Reaffirmed June 2022, Revised January 1990, Issued October 1979, https://doi.org/10.4271/ARP1612A.